PCB Fabrication & Assembly
At Orbis Electrica, we support electronic product development from concept through full manufacturing. Through our trusted manufacturing partners and strict engineering oversight, we provide reliable PCB fabrication and PCB assembly services for prototypes, low-volume builds, and production systems.
The tables below summarise the manufacturing capabilities and technical limits available for printed circuit board fabrication and assembly.
PCB Fabrication Capabilities
| Feature | Capability |
|---|---|
| Board Materials | FR-4 (Standard, Mid-Tg, Hi-Tg), Halogen-Free, Metal Core, Polyester |
| Layer Count | 1 – 36 layers |
| Board Thickness | 0.08 mm – 6.0 mm |
| Thickness Tolerance | ±10% |
| Maximum Board Size | 600 mm × 1200 mm |
| Minimum Trace Width / Spacing | 3 mil / 3 mil |
| Impedance Control Tolerance | ±5% to ±10% |
| Maximum Copper Thickness | 6 oz (0.21 mm) |
| Minimum Mechanical Hole Size | 0.15 mm (6 mil) |
| Minimum Laser Drill Hole | 0.10 mm (4 mil) |
| Drill Hole Size Range | 0.15 mm – 6.5 mm |
| Minimum Solder Mask Bridge | 3 mil |
| Solder Mask Colours | Green, Yellow, Red, Black, White, Blue |
| Silkscreen Colours | White, Blue, Black, Red, Yellow |
| Electrical Testing | 10 V – 250 V |
| Testing Methods | Flying probe or fixture test |
Surface Finish Options
| Surface Finish |
|---|
| Lead-Free HASL |
| Immersion Gold (ENIG) |
| Golden Finger |
| Immersion Tin |
| Immersion Silver |
| OSP |
| Carbon Oil |
| Hard Gold (up to 100µ”) |
Flexible & Rigid-Flex PCB Capabilities
| Feature | Capability |
|---|---|
| Layer Count | 1 – 12 layers |
| Base Materials | Kapton, PI, PET (Flex), FR-4 (Rigid) |
| Base Material Thickness | 12.5 µm – 50 µm (Flex), 0.1 mm – 3.2 mm (Rigid) |
| Copper Thickness | 0.5 oz – 2 oz |
| Protective Film Thickness | 12 µm – 25 µm |
| Adhesive Thickness | 12 µm – 35 µm |
| Reinforcement Materials | PI, PET, FR-4, Stainless Steel |
| Maximum Board Size | 9.842″ × 19.685″ |
| Minimum Trace Width / Spacing | 0.002″ |
| Minimum Hole Size | 0.006″ |
PCB Assembly Capabilities
| Feature | Capability |
|---|---|
| Assembly Types | SMT, Through-Hole (THT), Hybrid |
| PCB Types Supported | Rigid PCB, Flexible PCB, Rigid-Flex PCB, Metal-Core PCB |
| Maximum PCB Size | 510 mm × 460 mm |
| Component Types | SMT 0201 or larger, BGA (0.3 mm pitch), QFP (0.3 mm pitch), cables & wires |
| Solder Type | Lead-Free (RoHS compliant) |
| Parts Procurement Options | Full Turnkey, Partial Turnkey, Kitted |
| Component Packaging | Bulk, Cut Tape, Partial Reel, Full Reel, Tube, Tray |
| Stencil Type | Laser-cut stainless steel |
| Production Quantity | Prototype to high-volume production |
| Lead Time Options | 24 hours, 3–5 days, 1–2 weeks, or scheduled deliveries |
Assembly Inspection & Testing
- X-Ray inspection
- In-Circuit Testing (ICT)
- Functional Testing (FCT)
- IC Programming
- Custom Testing
- Design for Manufacturability (DFM) checking
These capabilities allow Orbis Electrica to support projects ranging from rapid prototyping to full production manufacturing with robust inspection and quality control processes.