High Tg PCB
At Orbis Electrica, our High Tg (Glass Transition Temperature) Printed Circuit Boards (PCBs) are engineered for extreme thermal and mechanical conditions, delivering reliability and performance where standard boards fail. High Tg PCBs maintain structural and electrical integrity under prolonged heat exposure, repeated thermal cycling, and high-stress operational environments, making them ideal for demanding applications in automotive, industrial, aerospace, and telecommunications sectors.
What Is a High Tg PCB?
The term “Tg” represents the glass transition temperature, the point where a PCB substrate changes from a rigid state to a more flexible, rubber-like state under heat. High Tg PCBs are made from advanced laminates that can withstand 170°C or higher, ensuring dimensional stability, mechanical strength, and consistent electrical performance. These materials include enhanced FR4, BT epoxy, and other high-temperature resins. High Tg PCBs are available in single-sided, double-sided, multilayer, and HDI formats, often integrated into rigid or rigid-flex assemblies for maximum design versatility.
Key Benefits
Superior Thermal Stability
High Tg PCBs resist deformation and maintain mechanical rigidity during soldering, lead-free assembly, and prolonged high-temperature operation, minimizing board warping and component stress.
Dimensional & Mechanical Reliability
Maintains flatness and alignment of components under thermal cycling, which is crucial for multilayer PCBs and high-density interconnect designs.
Enhanced Electrical Performance
Low dielectric loss and stable insulation properties at high temperatures help preserve signal integrity in high-frequency, RF, and high-speed digital circuits.
Long-Term Reliability
High Tg laminates withstand repeated heating and cooling cycles without degradation, reducing failure rates in critical and long-life electronics.
Lead-Free Assembly Compatibility
Designed to endure higher peak reflow temperatures required for RoHS-compliant lead-free soldering processes without compromising board quality.
Compatibility With Multilayer & HDI Designs
High Tg materials support advanced multilayer structures with high-density routing, blind and buried vias, and fine-line trace patterns, ensuring robust electrical and mechanical performance.
Reduced Thermal Stress on Components & Improved Reliability in Harsh Environments
By keeping the substrate stable under heat, high Tg boards reduce mechanical stress on solder joints and mounted components, extending product life. Ideal for automotive under-hood electronics, industrial machinery, and aerospace systems exposed to vibration, high heat, or moisture.
Typical Applications
High Tg PCBs are essential for mission-critical and thermally demanding applications such as:
- Automotive electronics, ECUs, and battery management systems
- Industrial automation and power electronics
- Telecommunications and 5G infrastructure
- Aerospace, defence, and avionics modules
- Renewable energy inverters and solar controllers
- Medical diagnostic, imaging, and monitoring devices
- High-speed computing and edge devices requiring thermal resilience
Customisation & Manufacturing Expertise
Orbis Electrica provides High Tg PCB solutions tailored to your specific performance and thermal requirements, including: • Material selection: high-Tg laminates for thermal and mechanical performance • Stack-up and layer design optimized for heat dissipation and electrical integrity • Thermal simulation and validation to ensure reliability • Multilayer and HDI fabrication with precise layer registration • Support for lead-free assembly and advanced soldering processes • Quality inspection, testing, and thermal stress verification We ensure that every high Tg PCB we manufacture delivers consistent, reliable performance in high-temperature, high-stress, and mission-critical environments.